1.1 describe the production of solid-state devices common to the electronics industry
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Learning outcomes
On successful completion of
this unit a learner will:
Assessment criteria for pass
The learner can:
LO1 Understand the production
and packaging of solid-state
electronic devices
1.1 describe the production of solid-state devices common
to the electronics industry
1.2 evaluate the different types of device packaging
Available
LO2 Understand electronic
component design
parameters
2.1 explain the effects of altering given design rules on
microelectronic devices
2.2 explain failure modes and mechanisms for a range of
microelectronic devices
LO3 Understand the methods
used for the design,
simulation, manufacture and
testing of printed circuit
boards (PCB)
3.1 explain the design and simulation of single- and multilayer
PCBs
3.2 specify the types of equipment required for automated
PCB manufacture and assembly
3.3 explain the methods of testing completed PCBs and
finished electronic products
3.4 explain the methods of designing and producing casings
and housings for electronic products
LO4 Understand the key
elements of an automated
PCB assembly facility
4.1 describe the key elements of an automated PCB
assembly facility
4.2 evaluate the use of robots for components placement
including selection criteria and associated costs.
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